Korean AI semiconductor startup FuriosaAI announced the technical details of its third-generation AI inference accelerator yesterday.
The accelerator was developed in collaboration with Broadcom, featuring two "mask limit-level" 2nm computing dies, one independent I/O die, 12 HBM4(E) memory stacks each with 48GB capacity, and using a SUE full interconnection topology within the rack, supporting PCIe Gen7.
FuriosaAI stated that the physical size of the chip is about eight times that of the second-generation chip (RGND); the computing power can reach 32 PFLOPS, 32 times that of RGND; the HBM memory capacity reaches 576GB, 12 times that of RGND; and the HBM memory bandwidth reaches 48TB/s, also 32 times that of RGND.
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