The future of semiconductor manufacturing may no longer require humans to enter cleanrooms. At the event held in San Jose, California, global memory chip giant and have for the first time reached a shared vision: to create a fully automated "AI autonomous factory" by 2030 through the use of artificial intelligence and digital twin technology.

Its transformation plan is extremely ambitious. According to its published roadmap, the company aims to upgrade all of its production bases at home and abroad by 2030. The core methods include:

Full-process Digital Twin: Using high-precision simulation to rehearse each production process in the virtual world.

Deployment of AI Agents: Letting intelligent systems make decisions autonomously, which has already reduced equipment recovery time to one-third of the original.

Humanoid Robots on Duty: Planning to introduce large-scale manufacturing robots to achieve unmanned operations from material handling to precision assembly.

At the same time, also revealed its three technological core strengths: Operational AI, Physical AI, and Digital Twins. As the pillars of its autonomous factory construction, these technologies have already shown initial effectiveness in practical applications, improving the efficiency of equipment maintenance and defect analysis by more than 50%.

From "machine-assisted human" to "AI autonomous takeover," this revolution in semiconductor manufacturing is not only about achieving maximum efficiency, but also about achieving zero-error production at the micrometer level through AI. With the coordinated efforts of global branches such as , the chip factories of 2030 may truly become a "no-human zone" built from silicon wafers and algorithms.