Text: On December 25, 2025, the "Promotion Conference on the Construction of the Smart Chip Application Ecosystem" hosted by the China Academy of Information and Communications Technology (CAICT) was successfully held in Beijing. The conference attracted representatives from enterprises in the fields of smart chips, complete machines, software, and computing infrastructure, as well as experts from industries such as healthcare, automotive, and power, who jointly discussed the future development of smart chips.

At the meeting, Wang Zhiqin, vice president of CAICT, gave an in-depth analysis of the current situation and major challenges facing the smart chip industry. She pointed out that smart computing chips are core technologies driving the intelligent development of the economy and society. Although China has made significant progress in this area, it still faces issues such as fragmented industrial structure, lack of unified evaluation standards, and poor supply-demand matching. To address these challenges, CAICT is actively collaborating with the industry to promote technological research, standard formulation, and application promotion, aiming to build a more complete smart chip industry ecosystem.

Wang Juncheng, director of the Institute of Informationization and Industrialization Integration at CAICT, also reported on the progress of the construction of the smart chip application ecosystem. Since the launch of the ecosystem building work in July 2024, CAICT has achieved a series of substantial results by leveraging platforms such as the Advanced Computing Industry Development Alliance and the National Advanced Computing Technology Innovation Competition. In terms of standards and testing, a comprehensive standard system covering chips, complete machines, and application scenarios is being rapidly established. The self-developed smart chip benchmark testing tool AC Bench has completed testing of chips from more than 20 leading companies, providing strong support for industry development. At the same time, in terms of application promotion, CAICT has compiled application guidelines for smart chips in fields such as automotive, healthcare, and power, and through events such as supply-demand matchmaking meetings, it promotes collaboration across the industrial chain and improves the efficiency of supply-demand matching.

The conference also invited multiple industry users and representatives from smart chip enterprises to share their experiences and challenges in fields such as healthcare, automotive, and power, fully demonstrating the potential of "industrial-user collaboration and mutual empowerment." In the future, ecosystem construction will be further advanced around aspects such as resource integration, compatibility, application promotion, and ecological co-construction.

The construction of the smart chip application ecosystem is a continuous systematic project that requires the joint efforts of all parties in the industrial chain. CAICT sincerely invites more smart chip enterprises and industry users to participate actively, and together promote the high-quality development of the smart chip industry.

Key Points:

🌟 This conference discussed the construction of the smart chip ecosystem and the issue of large-scale application, gathering industry experts to speak out together.

🤝 CAICT emphasized the need to unite all parties' efforts to solve structural problems facing the smart chip industry.

🚀 Future ecosystem construction will deepen resource integration and application promotion, promoting the prosperous development of the smart chip industry.