Masayoshi Son Plans to Establish AI Chip Company Izanagi, SoftBank Shares Surge


Samsung and Broadcom have reached a long-term deep cooperation, covering the entire supply chain of memory chips, foundry, and advanced packaging. It is expected that by 2030, the scale of cooperation will break through $200 billion, marking that AI chips have entered a stage of 'design plus manufacturing' deep integration. The core technology is Broadcom's ASIC custom design capabilities combined with Samsung's manufacturing. The two companies will jointly tackle challenges in sub-2nm process technology and HBM high-bandwidth memory fields.
Google's self-developed TPU transforms into commercial use, collaborating with Broadcom to provide AI infrastructure for customers such as Anthropic, directly targeting NVIDIA's 86% market share. With cost and system advantages, the commercialization process is accelerating, reshaping the competitive landscape of AI chips.
Samsung Electronics is facing a production capacity crisis due to the surge in demand for AI chips and plans to build an advanced semiconductor packaging factory in Gwangju, South Korea, to expand its production capacity. Meanwhile, the company also announced a diversified investment strategy, including advancing the robotics industry in Gumi.
The founder of SoftBank, Masayoshi Son, believes that Elon Musk's space data center has limited value, and the advantage of saving electricity costs is not a decisive factor in the AI competition. He asserts that the ultimate winner of artificial intelligence will be determined by ground computing power, not space servers.
SoftBank CEO Masayoshi Son has recently updated his prediction about super artificial intelligence (ASI), stating that the technology will arrive within two years. Previously, he had adjusted the timeline multiple times, shortening it from the initial ten years to four years, and now further compressing it to two years, reflecting his extreme optimism about the speed of ASI development.