The translated data: Samsung Electronics has recently publicly stated that it will continue to increase its investment in the development of higher-density DRAM and NAND flash memory chips, while also researching new materials to break through the physical limits of chip performance and manufacturing processes, in order to meet the growing demand for AI computing. Samsung will also increase the production of HBM (High Bandwidth Memory) chips, a key component for AI chips. The company has indicated that it will focus on customizing HBM chips to meet the diverse AI computing needs of different clients. To support the long-cycle delivery of AI chips, Samsung will continue to optimize and refine its storage chip product lineup. Industry analysts believe that these measures by Samsung will help consolidate its leading position in the AI chip field.